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A Chinese semiconductor company: Focus on industry and confident in the future
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Author : JIUZHOU
Update time : 2023-09-27 09:33:26
The 24th China International Optoelectronics Expo was held grandly at the International Convention and Exhibition Center. At the booth of a semiconductor company, the company's chairman showed the vigorous vitality of semiconductors.
According to the chairman of the company, this semiconductor exhibition mainly displays products in three major directions - high-speed data communication VCSEL chips, automotive-grade high-performance lidar VCSELs and cost-effective consumer 3Ds VCSEL chips.
In terms of data communications, the semiconductor company displayed a full range of products from low speed to high speed, focusing on the performance and reliability data of high-speed 50G PAM4 VCSEL chips. The excellent performance of the products attracted a large number of audiences.
In terms of lidar, the semiconductor company demonstrated a new one-dimensional/two-dimensional addressable VCSEL chip for automotive blind-filling radar, as well as a vehicle-mounted main radar VCSEL chip that has passed AEC-Q102 automotive grade certification.
According to the chairman of this company, it is currently actively applying for IATF16949 system certification and is expected to obtain the certification by the end of the year. By then, all obstacles to the company's VCSEL products will be cleared, and a variety of VCSEL products will be available in batches.
In the field of smart cockpits, the semiconductor company jointly demonstrated the latest driver monitoring system (DMS) and gesture interaction system with the strong cooperation of partners such as image sensors and driver chips.
In addition, laser radar, 3D sensing VCSEL and advanced packaging series used in consumer products such as sweeping robots, mobile phones, and smart door locks were also unveiled at this Optics Expo.
Judging from the current product performance and reliability, according to the chairman of this company, its capabilities in the field of data communications are very close to those of international first-tier manufacturers.
In the field of radar, this semiconductor company's chips have reached the international first-tier level, especially the successful tape-out of two-dimensional addressable VCSEL chips, which has also pushed the company to a higher status.
All these achievements are mainly due to the company's courage to invest heavily in research and development. According to the chairman of this company, the number of R&D personnel in the company has more than doubled in the past year, and a large number of professional and technical talents from home and abroad, as well as highly educated graduates from key universities at home and abroad, have joined the company.
According to the chairman of the company, this semiconductor exhibition mainly displays products in three major directions - high-speed data communication VCSEL chips, automotive-grade high-performance lidar VCSELs and cost-effective consumer 3Ds VCSEL chips.
In terms of data communications, the semiconductor company displayed a full range of products from low speed to high speed, focusing on the performance and reliability data of high-speed 50G PAM4 VCSEL chips. The excellent performance of the products attracted a large number of audiences.
In terms of lidar, the semiconductor company demonstrated a new one-dimensional/two-dimensional addressable VCSEL chip for automotive blind-filling radar, as well as a vehicle-mounted main radar VCSEL chip that has passed AEC-Q102 automotive grade certification.
According to the chairman of this company, it is currently actively applying for IATF16949 system certification and is expected to obtain the certification by the end of the year. By then, all obstacles to the company's VCSEL products will be cleared, and a variety of VCSEL products will be available in batches.
In the field of smart cockpits, the semiconductor company jointly demonstrated the latest driver monitoring system (DMS) and gesture interaction system with the strong cooperation of partners such as image sensors and driver chips.
In addition, laser radar, 3D sensing VCSEL and advanced packaging series used in consumer products such as sweeping robots, mobile phones, and smart door locks were also unveiled at this Optics Expo.
Judging from the current product performance and reliability, according to the chairman of this company, its capabilities in the field of data communications are very close to those of international first-tier manufacturers.
In the field of radar, this semiconductor company's chips have reached the international first-tier level, especially the successful tape-out of two-dimensional addressable VCSEL chips, which has also pushed the company to a higher status.
All these achievements are mainly due to the company's courage to invest heavily in research and development. According to the chairman of this company, the number of R&D personnel in the company has more than doubled in the past year, and a large number of professional and technical talents from home and abroad, as well as highly educated graduates from key universities at home and abroad, have joined the company.
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