Industry News
A domestic company: AWG chip products for 400G and 800G optical modules are being developed
Views : 722
Author : JIUZHOU
Update time : 2023-01-13 10:57:19
A domestic company revealed in an investor event that the company is developing AWG chip products for 400G and 800G optical modules to meet the market's demand for higher speeds.
Recently, a domestic company held a survey of investors with specific targets. Its main business includes optical chips and devices, indoor optical cables, and cable materials. The optical chip and device segment currently mainly includes three categories of products: PLC optical splitter chip series, AWG chip series and DFB laser chip series.
The PLC optical splitter chip series products are mature products, and there are new applications in Gigabit-to-the-home (FTTR), and it is expected to increase in the new year. The company has already done a good job in terms of production capacity and yield. adequate preparation.
There are two application scenarios for AWG chip series products: one is in the field of data centers, where we occupy a certain proportion of 100G/200G speeds, and are now developing towards 400G/800G or even higher speeds. Relying on the advantages of the company's IDM model, we have established close cooperative relations with optical module head companies, especially silicon optical module companies; the second is the application in traditional backbone networks and metropolitan area networks. With the acceleration of coherent technology in backbone networks As well as the sinking of wavelength division multiplexing technology, new applications have emerged—extended channels, L-band, and ultra-large bandwidth AWG products. The related AWG modules of this product have completed sample delivery, and some specifications are still under customer verification.
In terms of DFB laser chip series products, DFB lasers with multiple specifications of 2.5G and 10G have been sold in batches, and most of the 25G DFB laser chips are still under customer verification; in addition, high-power DFB laser chips are used in lidar, gas sensing, ZR Products in the coherent and satellite communications arenas are also advancing.
The following is the information of this investor activity:
1. Q: What is the competitive landscape of passive products?
A: There are many passive device suppliers in China, and the competition is fierce. However, the company is an IDM full-process model, with independent and controllable chips and quick response to demand, which has certain advantages. For example, in terms of PLC optical splitters and AWG products, the competition for components and modules is fierce, but the technical barriers to competition for chips are high. The company starts from the chip and adopts the IDM full-process model. Therefore, the company has certain advantages in PLC optical splitters and AWG products.
2. Q: How about the demand of customers in North America next year? What is the outlook for the demand for optical chips?
A: North America has always been at the forefront in terms of data center demand, especially in short-distance transceiver devices. North America has always been a leader. However, affected by unfavorable factors such as the epidemic, the demand is also uncertain, but the increase in product speed is clear. Therefore, the company is developing AWG chip products for 400G and 800G optical modules to meet the market's demand for higher speeds.
3. Q: What is the outlook for growth in the new year?
A: In the new year, the company is very confident in the company's products and research and development. Including the application of non-uniform PLC optical splitter chip in FTTR, the application of AWG chip in the field of data center, the application of AWG chip in the backbone network/MAN, and the application of high-power DFB laser chip in new fields, etc. I am very confident.
4. Q: What is the progress of FTTR's domestic expansion?
A: At present, operators and equipment manufacturers have not yet publicly invited bids. The promotion of FTTR depends on the actual situation and national policies in the new year, but the company has made full preparations in terms of technology and production capacity.
5. Q: What market is the 25G DFB laser chip mainly targeting? How is the progress?
A: 25G DFB is currently developed for the 5G market, access network, and data center market. The company's 25G DFB is still in the stage of optimization and sample verification.
6. Q: The company is an IDM model, are all links self-made?
A: The company's passive chip platform and active chip platform, all links are IDM mode, all are self-made, including epitaxy, which is also the company's advantage.
Recently, a domestic company held a survey of investors with specific targets. Its main business includes optical chips and devices, indoor optical cables, and cable materials. The optical chip and device segment currently mainly includes three categories of products: PLC optical splitter chip series, AWG chip series and DFB laser chip series.
The PLC optical splitter chip series products are mature products, and there are new applications in Gigabit-to-the-home (FTTR), and it is expected to increase in the new year. The company has already done a good job in terms of production capacity and yield. adequate preparation.
There are two application scenarios for AWG chip series products: one is in the field of data centers, where we occupy a certain proportion of 100G/200G speeds, and are now developing towards 400G/800G or even higher speeds. Relying on the advantages of the company's IDM model, we have established close cooperative relations with optical module head companies, especially silicon optical module companies; the second is the application in traditional backbone networks and metropolitan area networks. With the acceleration of coherent technology in backbone networks As well as the sinking of wavelength division multiplexing technology, new applications have emerged—extended channels, L-band, and ultra-large bandwidth AWG products. The related AWG modules of this product have completed sample delivery, and some specifications are still under customer verification.
In terms of DFB laser chip series products, DFB lasers with multiple specifications of 2.5G and 10G have been sold in batches, and most of the 25G DFB laser chips are still under customer verification; in addition, high-power DFB laser chips are used in lidar, gas sensing, ZR Products in the coherent and satellite communications arenas are also advancing.
The following is the information of this investor activity:
1. Q: What is the competitive landscape of passive products?
A: There are many passive device suppliers in China, and the competition is fierce. However, the company is an IDM full-process model, with independent and controllable chips and quick response to demand, which has certain advantages. For example, in terms of PLC optical splitters and AWG products, the competition for components and modules is fierce, but the technical barriers to competition for chips are high. The company starts from the chip and adopts the IDM full-process model. Therefore, the company has certain advantages in PLC optical splitters and AWG products.
2. Q: How about the demand of customers in North America next year? What is the outlook for the demand for optical chips?
A: North America has always been at the forefront in terms of data center demand, especially in short-distance transceiver devices. North America has always been a leader. However, affected by unfavorable factors such as the epidemic, the demand is also uncertain, but the increase in product speed is clear. Therefore, the company is developing AWG chip products for 400G and 800G optical modules to meet the market's demand for higher speeds.
3. Q: What is the outlook for growth in the new year?
A: In the new year, the company is very confident in the company's products and research and development. Including the application of non-uniform PLC optical splitter chip in FTTR, the application of AWG chip in the field of data center, the application of AWG chip in the backbone network/MAN, and the application of high-power DFB laser chip in new fields, etc. I am very confident.
4. Q: What is the progress of FTTR's domestic expansion?
A: At present, operators and equipment manufacturers have not yet publicly invited bids. The promotion of FTTR depends on the actual situation and national policies in the new year, but the company has made full preparations in terms of technology and production capacity.
5. Q: What market is the 25G DFB laser chip mainly targeting? How is the progress?
A: 25G DFB is currently developed for the 5G market, access network, and data center market. The company's 25G DFB is still in the stage of optimization and sample verification.
6. Q: The company is an IDM model, are all links self-made?
A: The company's passive chip platform and active chip platform, all links are IDM mode, all are self-made, including epitaxy, which is also the company's advantage.
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